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Contact

• workPower Electronics & Machines Centre
  Jubilee Campus
  Wollaton Road
  Nottingham
  NG8 1BB
  UK
• pearl.agyakwa@nottingham.ac.uk

Biography

I am an experimental materials scientist with several years' experience in the characterisation of fine-scale microstructures relating to fatigue and creep, including aerospace and power plant structures. My current role within the PEMC group, which I've held since 2007, is centred on elucidating the degradation mechanisms and failure physics of power electronics packaging components, including ultrasonically bonded wire interconnects, solder and sintered nanosilver die-attachments. My expertise includes exploring and quantifying three-dimensional damage morphologies using 3D X-ray computed microtomography methodologies and mapping damage by using nanoindentation properties. I also explore alternative sensory modalities for perceiving materials properties and exploring materiality.

I am also an interdisciplinary researcher, interested in the humanistic aspects of materials and manufacturing. I am interested in how political, historical and cultural contexts influence what and how materials and manufacturing methods are used.

Expertise Summary

My expertise and research interests include: ultrasonic joining, microscopy & microstructures, 3D X-ray tomography, micromechanical properties, deformation & fracture, metallurgy, fatigue & creep, soldering, sintering and joining technologies, visualisation and image analysis, sound, sonification, arts-informed research design and community engaged research.

Recent Publications

• DAI, JINGRU, LI, JIANFENG, AGYAKWA, PEARL, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2021. Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 21(4), 536-543
• DAI, JINGRU, LI, JIANFENG, AGYAKWA, PEARL, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2018. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 18(2), 256-265
• ARJMAND, E., AGYAKWA, P.A., CORFIELD, M., LI, J. and JOHNSON, C.M., 2016. IEEE Transactions on Components, Packaging and Manufacturing Technology. (In Press.)
• AGYAKWA, P.A., YANG, L., ARJMAND, E., EVANS, P., CORFIELD, M. and JOHNSON, C.M., 2016. Journal of Electronic Materials. 45(7), 3659–3672

• View all publications

• DAI, JINGRU, LI, JIANFENG, AGYAKWA, PEARL, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2021. Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 21(4), 536-543
• DAI, JINGRU, LI, JIANFENG, AGYAKWA, PEARL, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2018. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 18(2), 256-265
• ARJMAND, E., AGYAKWA, P.A., CORFIELD, M., LI, J. and JOHNSON, C.M., 2016. IEEE Transactions on Components, Packaging and Manufacturing Technology. (In Press.)
• AGYAKWA, P.A., YANG, L., ARJMAND, E., EVANS, P., CORFIELD, M. and JOHNSON, C.M., 2016. Journal of Electronic Materials. 45(7), 3659–3672
• ARJMAND, E., AGYAKWA, P.A., CORFIELD, M., LI, JIANFENG, MOUAWAD, B. and JOHNSON, C.M., 2016. Microelectronics Reliability. 59, 126-133
• ELEFFENDI, M.A., YANG, L, AGYAKWA, P.A. and JOHNSON, C.M., 2016.
• ARJMAND, E., AGYAKWA, P.A. and JOHNSON, C.M., 2014. Microelectronics Reliability.
• JIANFENG LI, PEARL AGYAKWA, PAUL EVANS, CHRISTOPHER MARK JOHNSON, YIMIN ZHAO, YIBO WU, KIM EVANS, 2014. Packaging / assembling technologies for a high performance SiC-based planar power module In: Greener Aviation Conference.
• J.F. LI, P.A. AGYAKWA, C.M. JOHNSON, 2014. Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes International Journal of Materials Engineering and Technology. 12(1), 25-36
• YANG, L., AGYAKWA, P.A. and JOHNSON, C.M., 2014. IEEE Transactions on Device and Materials Reliability. 14(4), 6891277
• WANG, Y., LI, J., AGYAKWA, P.A., JOHNSON, C.M. and LI, S., 2014. Molecular Crystals and Liquid Crystals. 604(1), 11-26
• LI, J. F., AGYAKWA, P. A. and JOHNSON, C. M., 2014. JOURNAL OF ELECTRONIC MATERIALS. 43(4), 983-995
• AGYAKWA, P. A., MARQUES, V. M. F., CORFIELD, M. R., LI, J. F., YANG, L. and JOHNSON, C. M., 2013. JOURNAL OF ELECTRONIC MATERIALS. 42(3), 537-544
• AGYAKWA, P.A., YANG, L., CORFIELD, M. and JOHNSON, C.M., 2012. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography In: 8th International Conference on Integrated Power Electronics Systems, CIPS 2014.
• AGYAKWA, PA, CORFIELD, MR, YANG, L, LI, JF, MARQUES, VMF and JOHNSON, CM, 2011. Microelectronics Reliability. 51(2), 406-415
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2011. Acta Materialia. 59(3), 1198-1211
• YANG, L., AGYAKWA, P. A. and JOHNSON, C. M., 2011. MICROELECTRONICS RELIABILITY. 51(9-11), 1882-1886
• CASTELLAZZI, A., SOLOMON, A., AGYAKWA, P., LI, J., TRENTIN, A. and JOHNSON, C. M., 2010. High power density, low stray inductance, double sided cooled matrix-converter type switch In: 2010 International Power Electronics Conference (IPEC).
• MATTEY, N., SKURIAT, R., LI, J., AGYAKWA, P., EVANS, P. and JOHNSON, C.M., 2010. Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module In: Electronic System-Integration Technology Conference (ESTC), 13-16 Sept. 2010.
• AGYAKWA, P.A., CORFIELD, M.R., LI, J.F., LOH, W.-S., LIOTTI, E., HOGG, S.C. and JOHNSON, C.M., 2010. IEEE Transactions on Device and Materials Reliability. 10(2), 254-262
• LI, J.F., AGYAKWA, P.A., JOHNSON, C.M., ZHANG, D., HUSSAIN, T. and MCCARTNEY, D.G., 2010. Surface and Coatings Technology. 204(9-10), 1395-1404
• SOLOMON, A., CASTELLAZZI, A., HOYLAND, R., AGYAKWA, P., JIANFENG LI and JOHNSON, C.M., 2009. A highly integrated high-voltage bi-directional switch In: ISDRS '09. International Semiconductor Device Research Symposium, 2009..
• HUA LU, RIDOUT, S., BAILEY, C., WEI SUN LOH, AGYAKWA, P. and JOHNSON, M., 2008. In: Electronic Packaging Technology & High Density Packaging, 28-31 July 2008.
• 2003. In: ANISOTROPIC BEHAVIOUR OF DAMAGED MATERIALS: Anisotropic creep and fracture behaviour of a 9CrMoNbV weld metal at 650 degrees C 9. 295-316
• HYDE, TH, SUN, W, AGYAKWA, PA, SHIPWAY, PH and WILLIAMS, JA, Anisotropic creep and fracture behaviour of a 9CrMoNbV weld metal at 650 degrees C ANISOTROPIC BEHAVIOUR OF DAMAGED MATERIALS. 9, 295-316