糖心原创

Department of
Mechanical, Materials and Manufacturing Engineering
 

Image of How Ho Cheng

How Ho Cheng

Associate Professor,

Contact

  • workRoom CA22 Block C
    Malaysia Campus
    Jalan Broga
    43500 Semenyih
    Selangor Darul Ehsan
    Malaysia
  • work+6 (03) 8924 8770
  • fax+6 (03) 8924 8017

Biography

Ir. Dr. How Ho Cheng graduated with his BEng (Hons) and PhD degrees in mechanical engineering from University of Strathclyde, Scotland, United Kingdom in 1994 and 1998, respectively. He is a chartered engineer registered under Engineering Council of United Kingdom, and also a professional engineer with Board of Engineers Malaysia.

Ir. Dr. How pursued his career in a high-paced semiconductor industry upon his graduation, and has extensive experience in both upstream wafer fabrication process, and downstream assembly and test of advanced packaging microprocessor device. He has established his areas of expertise in advanced packaging and assembly materials development, failure and root cause analysis, materials characterization techniques, and yield improvement methodology for a high-volume manufacturing environment.

Ir. Dr. How has been a full-time academic since December 2013.

Expertise Summary

Advanced packaging and assembly materials development; failure and root cause analysis; materials characterization techniques; yield improvement methodology for a high-volume manufacturing environment; carbon nanotubes; additive manufacturing.

Teaching Summary

Materials and Manufacturing; Design, Manufacture and Project; Making Metals Perform; Additive Manufacturing and 3D Printing; MEng/BEng Individual Project

Recent Publications

  • HOCK YEE WONG, HO CHENG HOW and JEE HOU HO, 2024. Journal of Advances in Materials and Processing Technologies. 1-10
  • TAN HONG ANN and HOW HO CHENG, 2023. In: MOHD ARIF ANUAR MOHD SALLEH, ed., Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: The Effect of Solder Geometry and Intermetallic Compound on Lead-Free Solder Joint Reliability 289. Springer Proceedings in Physics. 93-102
  • KHALIESAH ABBAS, ROBERT THOMAS BACHMANN, SIEW KOOI ONG, MOHAMAD FAUZI BIN ABRAHAM, WEI HONG WU, JASON SHIING LIK LING and HO CHENG HOW, 2023. In: Adv Struct Mater, Vol. 173, Azman Ismail et al. (Eds): Materials Innovations and Solutions in Science and Technology: Characterization of Oil Palm Frond-Based Biochar-Filled-Recycled PET Bio-composites 173. Springer Nature Switzerland AG. 233-250
  • SAFAEI B, HOW HC and SCRIBANO G, 2022. International Journal of Environmental Science and Technology.
  • HOCK YEE WONG, HO CHENG HOW and JEE HOU HO, 2024. Journal of Advances in Materials and Processing Technologies. 1-10
  • TAN HONG ANN and HOW HO CHENG, 2023. In: MOHD ARIF ANUAR MOHD SALLEH, ed., Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: The Effect of Solder Geometry and Intermetallic Compound on Lead-Free Solder Joint Reliability 289. Springer Proceedings in Physics. 93-102
  • KHALIESAH ABBAS, ROBERT THOMAS BACHMANN, SIEW KOOI ONG, MOHAMAD FAUZI BIN ABRAHAM, WEI HONG WU, JASON SHIING LIK LING and HO CHENG HOW, 2023. In: Adv Struct Mater, Vol. 173, Azman Ismail et al. (Eds): Materials Innovations and Solutions in Science and Technology: Characterization of Oil Palm Frond-Based Biochar-Filled-Recycled PET Bio-composites 173. Springer Nature Switzerland AG. 233-250
  • SAFAEI B, HOW HC and SCRIBANO G, 2022. International Journal of Environmental Science and Technology.
  • HOCK YEE WONG, HO CHENG HOW and JEE HOU HO, 2022. Journal of Physics: Conference Series. 2169(1), 012022
  • HO CHENG HOW, YUEN LEONG CHOW, HOCK YEE WONG, JEE HOU HO and CHUNG LIM LAW, 2022. Materials Today Proceedings. 66(5), 2655-2659
  • NARESH K. UTHAMA KUMARAN, HO CHENG HOW, GIRMA T. CHALA, POON HAN WONG and EDMUND DE ALWIS, 2022. Performance Evaluation and Optimization of Advanced Cyclone System for Palm Waste Induced Flue Gas Petroleum and Coal. 64(4), 838-852
  • HOCK, TEE K., CHALA, GIRMA T. and CHENG, HOW H., 2020. An innovative hybrid steam-microwave sterilization of palm oil fruits at atmospheric pressure INNOVATIVE FOOD SCIENCE & EMERGING TECHNOLOGIES. 60,
  • KIAN LU SIA, SYED ALIF ILYASAK BARAKBAH and HO CHENG HOW, 2019. Characterization of Electrical Current Stress and Indentation Creep of Carbon Nonotubes-reinforced Low Melting Temperature Sn-58Bi Composites IOP Conf. Series: Materials Science and Engineering 701, 2019, 012060.
  • AISHA, SUI RABIATULL, OURJIN, A., WAH, N. M., HOWAND, H. C. and CHIN, Y. T., 2011. Interfacial Reactions of SAC305 and SAC405 Solders on Electroless Ni(P)/Immersion Au and Electroless Ni(B)/Immersion Au Finishes PROCEEDINGS OF THE 2010 34TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT 2010).
  • HOW, HC and BAKER, TN, 1999. Characterisation of sliding friction-induced subsurface deformation of Saffil-reinforced AA6061 composites WEAR. 232(1), 106-115
  • HOW, HC and BAKER, TN, 1997. Dry sliding wear behaviour of Saffil-reinforced AA6061 composites WEAR. 210(1-2), 263-272
  • HOW, HC and BAKER, TN, 1997. The influence of sliding velocity on the dry sliding wear behaviour of a Saffil-reinforced AA6061 composite EUROMAT 97 - PROCEEDINGS OF THE 5TH EUROPEAN CONFERENCE ON ADVANCED MATERIALS AND PROCESSES AND APPLICATIONS: MATERIALS, FUNCTIONALITY & DESIGN, VOL 1. 41-44

Department of Mechanical, Manufacturing and Materials Engineering

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telephone: +44 (0) 115 95 14081